Jan/02/2025 - SPEG 1.51 Added support for 64Mbyte (512Mbit) SPI chips Winbond 25R512JVEQ, Winbond 25R512NV, etc. These SPI chips are widely used in Dell's and Lenovo's newer models (T16 Gen2 and later). --------------------------------------- July/14/2023 - SPEG 1.5q Added MX25U6435F Some minor bugs fixed. February/06/2020 - SPEG 1.4q Support for enabling/disabling QPI mode on QUAD speed serial flash chips. Useful for chip which have this option active from factory, such as Winbond W25Q128FVJQ, etc. --------------------------------------- August/01/2018 - SPEG 1.4d Some minor bugs fixed. --------------------------------------- March/06/2016 - SPEG 1.4 Read/write bug fixed which resulted in 2x-3x speed gains, considerably reducing the read and write time. --------------------------------------- Aug/14/2014 - SPEG 1.3 Now fully supports 4 byte adressing for high density SPI flashes, bigger than 16 Mbyte (32 Mbyte and up). Added 32Mbyte chips, like MX25l25635FMI-10G (used in Playstation 4). --------------------------------------- Jan/17/2014 - SPEG 1.2 Added EON EN25XXXX --------------------------------------- Feb/15/2013 - SPEG 1.1b Added Micron (former Numonyx) range from N25Q016A - N25Q0256A. These are largely used in Macbooks ....................................... July/01/2012 - SPEG 1.1a Added ST Micro M25PX16, M25PX32 and M25PX64 ....................................... May/24/2011 - SPEG 1.1 Added new Winbond W25QXX, including W25Q256VF ....................................... Feb/11/2010 - SPEG 1.0a Small fixes in JEDEC ID table. Tested with success for MX25L6405DMI-12G used in newer TP models like W500. ....................................... Oct/7/2009 - SPEG 1.0 Initial release